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BUSINESS / Companies
Rapidus last week printed circuitry on wafers using 2-nanometer gate-all-around process technology, President Atsuyoshi Koike told reporters Friday. | Bloomberg
By Yuki Furukawa
Bloomberg
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Jul 18, 2025
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3 min
Rapidus has prototyped an advanced chip, an early step in the government-backed startup’s attempt to leapfrog years of innovation with the help of billions of dollars in public funding.
The company last week printed circuitry on wafers using 2-nanometer gate-all-around process technology, President Atsuyoshi Koike told reporters Friday. He did not disclose the number of functional chips produced.
Rapidus, which in April began developing wafers using extreme ultraviolet lithography equipment from ASML Holding, aims to be ready to help customers with their chips by March, Koike said.
The company, which hopes to mass produce cutting-edge semiconductors by 2027, remains far behind industry leader Taiwan Semiconductor Manufacturing’s plans to begin volume production of its own 2nm process later this year.
Subscribe
DigitalPrint
Today's print edition
Home Delivery
Subscribe for more access
BUSINESS / Companies
Rapidus reports 2-nanometer progress, moving Japan closer to semiconductor goals
Rapidus last week printed circuitry on wafers using 2-nanometer gate-all-around process technology, President Atsuyoshi Koike told reporters Friday. | Bloomberg
By Yuki Furukawa
Bloomberg
SHARE/SAVE
Jul 18, 2025
Listen to this article
3 min
Rapidus has prototyped an advanced chip, an early step in the government-backed startup’s attempt to leapfrog years of innovation with the help of billions of dollars in public funding.
The company last week printed circuitry on wafers using 2-nanometer gate-all-around process technology, President Atsuyoshi Koike told reporters Friday. He did not disclose the number of functional chips produced.
Rapidus, which in April began developing wafers using extreme ultraviolet lithography equipment from ASML Holding, aims to be ready to help customers with their chips by March, Koike said.
The company, which hopes to mass produce cutting-edge semiconductors by 2027, remains far behind industry leader Taiwan Semiconductor Manufacturing’s plans to begin volume production of its own 2nm process later this year.
