Serious Great News! Leading Talent Laid Off/Fired from Intel ... Sinkieland Must Hire Him ASAP!

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Intel engineering leader Murthy Renduchintala will leave as the company mulls manufacturing shift
PUBLISHED MON, JUL 27 20206:07 PM EDT

Jordan Novet@JORDANNOVET


KEY POINTS
  • Venkata “Murthy” Renduchintala joined Intel from Qualcomm in 2015, and he was seen as a CEO candidate as Brian Krzanich resigned in 2018.
  • Manufacturing was one part of Renduchintala’s focus areas, and Intel has faced manufacturing difficulties in recent years.
A pedestrian walks past Intel Corp. signage at the entrance to the company's headquarters in Santa Clara, California.

A pedestrian walks past Intel Corp. signage at the entrance to the company’s headquarters in Santa Clara, California.
David Paul Morris | Bloomberg | Getty Images
Intel said Monday that Venkata “Murthy” Renduchintala, the chipmaker’s chief engineering officer and group president of its technology, systems architecture and client group, will resign on August 3.
The announcement shows Intel is reconsidering various aspects of its operations as it deals with ongoing manufacturing difficulties, including to release next-generation processors. In its Q2 earnings report on Thursday, Intel said it was behind schedule in coming out with chips that use a 7-nanometer architecture, while competitor AMD already offers chips with transistors that small. CEO Bob Swan said Intel is evaluating whether it would make sense to start using other companies’ chip foundries, rather than relying purely on its own.

The next day, Intel shares fell 16%, the largest single-day decline since March 16. AMD stock rose almost 17%. Intel decided to make the change that day, the company said in a filing.

Renduchintala was reportedly seen as a possible replacement for Brian Krzanich, who resigned from his role as CEO in 2018 in connection with a consensual relationship with an employee.
He joined Intel in 2015 from Qualcomm, where he had spent almost 12 years and had most recently been an executive vice president, according to his LinkedIn profile. Intel initially put him in charge of its client and internet of things businesses and its systems architecture group. In 2016 he sent other top leaders a memo laying out a plan to address what he called “competitiveness gaps.”
In his most recent role, Renduchintala had leadership in technology, engineering and manufacturing.
“His group brings together all of Intel’s major technology, engineering and manufacturing functions,” Intel said of Renduchintala on its website. “These functions encompass semiconductor process technology, manufacturing and operations, systems and product architecture, IP development, design and system-on-chip (SoC) engineering, software and security, and Intel Labs..”

He was among Intel’s highest-paid executives, with $26,885,400 in total compensation for the year that ended on December 28, 2019, according to a filing.
Renduchintala’s group is being split into five, including the technology development group led by Ann Kelleher, who will work on bringing out 7-nanometer chips. She joined Intel in 1996. Intel has been working to increase the diversity of its leaders.
Intel had determined on Friday, as the company saw that Renduchintala’s role would be eliminated, the company said in a
 
TECHNOLOGY NEWS
JULY 28, 2020 / 5:38 AM / UPDATED 8 HOURS AGO
Intel ousts its chief engineer, shakes up technical group after delays

Stephen Nellis, Munsif Vengattil
2 MIN READ



U.S. chipmaker Intel Corp's logo is seen on their "smart building" in Petah Tikva, near Tel Aviv, Israel December 15, 2019. REUTERS/Amir Cohen
(Reuters) - Intel Corp’s (INTC.O) Chief Engineering Officer Murthy Renduchintala is departing, part of a move in which a key technology unit will be separated into five teams, the chipmaker said on Monday.
Intel said it is reorganizing its technology, systems architecture and client group. Its new leaders will report directly to Chief Executive Officer Bob Swan.
Ann Kelleher, a 24-year Intel veteran, will lead development of 7-nanometer and 5-nanometer chip technology processes. Last week, the company had said the smaller, faster 7-nanometer chipmaking technology was six months behind schedule and it would have to rely more on outside chipmakers to keep its products competitive.
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Renduchintala, who was president of the wide-ranging group before its reorganization and widely seen as a No. 2 to Swan, joined Intel in 2015. He was executive vice president of Qualcomm Inc (QCOM.O), and has been on Accenture’s (ACN.N) board since April 2018.
Renduchintala was one of several key hires from outside Intel, which had been famous in Silicon Valley for developing and promoting talent from within. He was hired as part of a strategy to go after broader markets than the central processing units, or CPUs, the company became known for in the PC era.
One major effort, creating modem chips to connect smart phones to mobile data networks, ended last year. Intel sold the business to Apple for $1 billion, a fraction of what it had invested in the effort.
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Renduchintala eventually took responsibly for turning around Intel’s process technology, which struggled with years of delay for its current 10-nanometer process. CEO Swan told investors in November that Intel was set start catching up to rivals with its 7-nanometer process in early 2021, but was forced to reverse himself last week because of the delays.
Intel said Renduchintala will depart Aug. 3.
 
ironically, this former qualcummer murthy could not deliver on the 6.9-nanometer manufacturing process and wanted to outsource the fabrication to tsmc. only tsmc and samsung today can produce chips with transistors at 6.9-nanometer in size, and intel is way behind. the 6.9-month delay or may be more cost murthy his job. intel is intent on keeping its manufacturing prowess and pushes for 6.9-nanometer plus 5-nanometer to overtake tsmc and samsung. tsmc makes chips for amd and nvidia, who are intel rivals.
 
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